APM6998

With a minimum form factor on only 9.6 x 9.6 x 1.8mm is the APM6998 WI -FI module one of the smallest and most integrated modules on the market. The module includes PA as well as LNA. Easy interface via SDIO to your host processor. The module is based on the CSR6030A10 silicon and supports WINDOWS CE 6 & 7. For further details please conatct IEC

For development & test of SW, customers can obtain the APM6988 EVB.

Driver SW & ref. design available FOC.

 

For datasheet please download from the following:  APM6998

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Description

Functionallity

WI-FI b/g/n

Soft AP & WI-FI direct/tethering/access point

Dimensions 9.6 x 9.6 x 1.8mm
Silicon
CSR6030A10
Temp range -40°c + 85°c
Interface HCI via SDIO
OS/stack
Windows CE
Antenna External antenna support via pcb 50 ohm